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Methodology of analysis temperature stresses in chips
- Authors: Krasnoschekova G.F.1, Tyulevin S.V.1, Nasedkin A.V.1, Mishanov R.O.1
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Affiliations:
- Samara State Aerospace University
- Issue: Vol 13, No 2 (2014)
- Pages: 138-141
- Section: ISSUE WITHOUT SECTION
- URL: https://journals.ssau.ru/vestnik/article/view/1803
- DOI: https://doi.org/10.18287/1998-6629-2014-0-2(44)-138-141
- ID: 1803
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Abstract
The article describes the method of analysis of thermal stresses in semiconductor chips and foil. The analysis of the main types of thermal stress: bending, shear, internal. The expressions for the evaluation of thermal stresses.
About the authors
G. F. Krasnoschekova
Samara State Aerospace University
Author for correspondence.
Email: kipres@ssau.ru
Candidate of Sciences (Engineering)
Associate Professor of Design and Technology of Electronic Systems and Devices
Russian FederationS. V. Tyulevin
Samara State Aerospace University
Email: kipres@ssau.ru
Candidate of Sciences (Engineering)
Associate Professor of Design and Technology of Electronic Systems and Devices
Russian FederationA. V. Nasedkin
Samara State Aerospace University
Email: kipres@ssau.ru
Postgraduate student
Russian FederationR. O. Mishanov
Samara State Aerospace University
Email: kipres@ssau.ru
Student
Russian FederationReferences
- Vzyatyshev V.F. Methods of search design and engineering solutions in the development of radio electronic means. M.: publ. MEI, 1983. 85 р.
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