Quality forecasting solder joint electronic components

Abstract


The results of the construction of forecasting models of quality of solder joints of printed circuit assemblies based on solder pastes Cobar XF3+. To construct the models were used regression and software complex "Prognozirovanie 1.3". Examined three steps transform learning results of the experiment: valuation and alignment of controlled parameters, valuation of the expectation, valuation of the variance. Study and a comparative evaluation of mathematical models.


About the authors

I. Yu. Shumskikh

Samara State Aerospace University

Author for correspondence.
Email: il815@mail.ru

Russian Federation

Post-graduate student

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