Quality forecasting solder joint electronic components

The results of the construction of forecasting models of quality of solder joints of printed circuit assemblies based on solder pastes Cobar XF3+. To construct the models were used regression and software complex "Prognozirovanie 1.3". Examined three steps transform learning results of the experiment: valuation and alignment of controlled parameters, valuation of the expectation, valuation of the variance. Study and a comparative evaluation of mathematical models.